Ag-Cu亚稳态合金薄膜的共溅射法制备及其特性研究

采用共溅射法,于不同温度下在玻璃基底上沉积Ag-Cu薄膜。X衍射(XRD)分析表明,当基片温度为100℃和200 ℃时,形成的是Ag-Cu亚稳态合金;而当温度升高到300℃以上时,形成的则是Ag和Cu的分离相。通过X光电子能谱(XPS)法测量不同温度下沉积薄膜的Ag和Cu原子含量比,发现基片加热温度对沉积元素的相对比有一定影响。原子力显微镜(AFM)检测表明,随着加热温度的升高,薄膜表面的粗糙度增加,颗粒尺寸增大。分析认为,在温度较低时,原子热激活能相对较低,不足以发生迁移,形成Ag-Cu亚稳态合金;而当温度较高时,原子热激活能增大,容易发生迁移,此时Ag和Ag、 Cu和Cu各自结合的能量最低,形成Ag和Cu的分离相。

Metastable Ag-Cu alloy thin films prepared by co-sputtering

By co-sputtering method,Ag-Cu thin films were prepared on substrate of glasses with temperature ranged from 100-500℃.XRD analysis indicated that metastable Ag-Cu alloys were formed when temperature of substrate was set at 100 ℃ and 200℃,and decomposition (Ag and Cu in separate phase) occurred when the temperature reached to 300℃ or more.In analysis with XPS,the relative ratio of Ag and Cu atoms in the deposited thin film correlated with both temperature and metastable status.And AFM analysis revealed that surface roughness of the thin films and size of the particles increased with raising temperature,which were more prominent when separate Ag and Cu were formed at higher temperature.