| 高导电高耐磨铜基材料研究进展 |
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| 引用本文： | 刘志农 莫德锋 胡正飞 何国求 马行驰. 高导电高耐磨铜基材料研究进展[J]. 材料导报, 2007, 21(F05): 421-423,427 |
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| 作者姓名： | 刘志农 莫德锋 胡正飞 何国求 马行驰 |
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| 作者单位： | 同济大学材料学院金属研究所,上海200092 |
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| 基金项目： | 国家863计划高速磁悬浮交通技术重大专项（2005AA505010）;教育部“新世纪优秀人才支持计划”（NCET-05-0388） |
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| 摘 要： | 介绍了几种主要高导电高耐磨铜基材料，指出添加石墨、陶瓷颗粒和合金元素可以提高材料的耐磨性，而导电率仍维持在较高水平，并对几种材料的增强机理作了初步探讨。回顾了近年来高导电高耐磨铜基材料的主要研究成果，并指出多元微合金化、基体纯化和晶粒细化、高度致密化为今后研究发展的方向。
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| 关 键 词： | 高导电 高耐磨 铜基材料 |
Progress in Studies on Copper-based Materials with High Conductivity and High Wear Resistance |
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| LIU Zhinong, MO Defeng, HU Zhengfei, HE Guoqiu, MA Xingchi. Progress in Studies on Copper-based Materials with High Conductivity and High Wear Resistance[J]. Materials Review, 2007, 21(F05): 421-423,427 |
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| Authors: | LIU Zhinong MO Defeng HU Zhengfei HE Guoqiu MA Xingchi |
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| Affiliation: | Institute for Metal-based Materials Research, School of Material Science and Engineering, Tongji University, Shanghai 200092 |
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| Abstract: | The category of copper-based materials with high conductivity and high wear resistance is introduced. The wear resistance can be greatly improved by the addition of graphite, particles and alloying elements while the electricity conductivity remains at a relatively high level. The strengthing mechanism is discussed primarily. The main progress in copper-based materials with high conductivity and high wear resistance in recent years is summarized, and multi-alloying, purification, densification of base materials and grain refinement are pointed to be the possible direction of the future. |
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| Keywords: | high conductivity high wear resistance copper-based materials |
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