碳化硼厚板的激光切割工艺及其机制

介绍了碳化硼陶瓷加工中存在的主要问题,将激光技术应用于加工碳化硼陶瓷上,研究出一种新型加工方法,设计出两种有效的激光切割方法并对碳化硼陶瓷进行切割。在实验基础上分析了激光加工参数对加工的影响,采用扫描电镜(SEM)对各种激光切割工艺的断口进行分析和讨论,提出激光加工碳化硼陶瓷的自行断裂机制。实验结果表明,在特定的功率下激光能够用来加工碳化硼陶瓷厚板。对于厚度为5.5 mm碳化硼陶瓷板,Nd∶YAG激光平均功率为130 W时,激光束沿同一位置重复走刀两次即可切断,最高切割速度可达到120 mm/min,可以做到无微裂纹切割。

Laser Cutting Processing and Mechanism for Thick Boron Plate

The main problems in boron carbide ceramic machining are introduced, and the laser technique is used to machine boron carbide. A new technique by applying the laser technology to cut boron carbide ceramic was developed. Two kinds of cutting methods for boron carbides were designed and tested. Based on experiments, the effect of technical parameters on cutting quality are discussed. The fracture in all kinds of cutting processing was analyzed by using scanning electron microscope (SEM) and the self-rupturing mechanism in laser maching boron carbide cearmic is proposed. Experimental results show that the laser techonolgy can be used for cutting thick boron carbide plates with specific laser power. In the experiments, the 5.5 mm-thick boron carbide can be separated by Nd∶YAG laser with power of 130 W scanning along the cutting path twice, and the maximum cutting speed can reach 120 mm/min. The boron carbide ceramic can be cut without any micro-crack.