| 晶体倒角工艺改进方法研究 |
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| 引用本文： | 罗夏林,甘禹,王强,冉孟红,丁雨憧,胡吉海,王洪刚.晶体倒角工艺改进方法研究[J].压电与声光,2023,45(2):255-257. |
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| 作者姓名： | 罗夏林 甘禹 王强 冉孟红 丁雨憧 胡吉海 王洪刚 |
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| 作者单位： | 中国电子科技集团公司 第二十六研究所,重庆 400060 |
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| 基金项目： | 重庆英才计划“包干制”资助项目(cstc2021ycjh-bgzxm0215)；重庆声光电有限公司自主投入专项基金资助项目(2605ZZ2022026) |
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| 摘 要： | 针对非标准尺寸的晶块和晶圆在倒角过程中存在崩边、崩缺等问题，该文通过设计并排式组合夹具和真空吸附盘组件将产品固定，同时设计45°和弧形刀具，然后采用单一直线和正偏移路径进行加工。实验结果表明，与传统的倒角工艺相比，优化能大幅度地降低倒角过程中产生的崩边、崩缺等问题，不合格率从14.78%降低到3.09%,有利于批量生产。
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| 关 键 词： | 晶体 倒角工艺 崩边 崩缺 批量生产 |
| 收稿时间： | 2022/9/6 0:00:00 |
Study on Improvement Method of Crystal Chamfering Process |
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| LUO Xialin,GAN Yu,WANG Qiang,RAN Menghong,DING Yuchong,HU Jihai,WANG Honggang.Study on Improvement Method of Crystal Chamfering Process[J].Piezoelectrics & Acoustooptics,2023,45(2):255-257. |
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| Authors: | LUO Xialin GAN Yu WANG Qiang RAN Menghong DING Yuchong HU Jihai WANG Honggang |
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| Affiliation: | The 26th Institute of Chine Electronics Technology Group Corporation, Chongqing 400060 , China |
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| Abstract: | To address the problems of edge collapse and crashing in the chamfering process of non-standard crystal bulk and wafers, the side by side modular fixtures and vacuum adsorption disk components are designed to fix the product, and the 45° and arc cutters are designed, and then the single straight line and positive offset path are used for processing. The experimental results show that compared with the traditional chamfering process, the optimized process can greatly reduce the edge collapse and crashing during the chamfering process, and the unqualified rate is reduced from 14.78% to 3.09%, which is beneficial for batch production. |
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