| 一种高耐湿无卤无铅覆铜板 |
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| 引用本文： | 何岳山,程涛. 一种高耐湿无卤无铅覆铜板[J]. 印制电路信息, 2010, 0(6): 25-27,40 |
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| 作者姓名： | 何岳山 程涛 |
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| 作者单位： | 广东生益科技股份有限公司,广东东莞,523039 |
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| 摘 要： | 当前无卤无铅CCL面临的问题很多，主要是从双面板材向多层板材转型过程中出现的吸湿耐热性和加工制造性，而这些是无铅PCB制程的可兼容，及产品长期稳定可靠的关键性能。文章分析了两类可行路线，并锁定最佳方向加以实施，结果非常理想。
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| 关 键 词： | 无卤无铅覆铜板 双酚F型苯并噁嗪 吸湿耐热性 加工制造性 |
A High Humidity Resistance Halogen-free Lead-free Copper Clad Laminate |
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| HE Yue-shan,CHEN Tao. A High Humidity Resistance Halogen-free Lead-free Copper Clad Laminate[J]. Printed Circuit Information, 2010, 0(6): 25-27,40 |
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| Authors: | HE Yue-shan CHEN Tao |
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| Affiliation: | HE Yue-shan CHEN Tao |
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| Abstract: | At present, halogen-free and lead-free CCL is confronted with many problems, the main problems are heat resistance after water absorption and processing properties, they appear in the process of double- sided printed board translates to multiplayer printed board, but these are key properties to ensure the lead-free PCB compatibility and keep the product stable and reliable in long time. The paper analyzed 2 feasible ways, we find the best way and put it in practice, the result is very good. |
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| Keywords: | halogen-free and lead-free CCL bis-F benzoxazine heat resistance after water absorption processing properties |
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