| 基于MCM-D工艺的3D-MCM工艺技术研究 |
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| 引用本文： | 刘欣,谢廷明,罗驰,刘建华,唐哲.基于MCM-D工艺的3D-MCM工艺技术研究[J].微电子学,2010,40(2). |
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| 作者姓名： | 刘欣 谢廷明 罗驰 刘建华 唐哲 |
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| 作者单位： | 中国电子科技集团,第二十四研究所,重庆,400060 |
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| 摘 要： | 基于MCM-D薄膜工艺,开展了3D-MCM相关的无源元件内埋置、芯片减薄、芯片叠层组装、低弧度金丝键合、芯片凸点,以及板级叠层互连装配等工艺技术研究。通过埋置型基板、叠层芯片组装、板级叠层互连,实现了3D-MCM结构,制作出薄膜3D-MCM样品;探索出主要的工艺流程及关键工序控制方法,实现了薄膜3D-MCM封装。
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| 关 键 词： | 3D-MCM 内埋置基板 叠层型结构 三维叠层互连 |
Study on 3-Dimensional Multi-Chip Module Technology Based on MCM-D Technique |
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| LIU Xin,XIE Tingming,LUO Chi,LIU Jianhua,TANG Zhe.Study on 3-Dimensional Multi-Chip Module Technology Based on MCM-D Technique[J].Microelectronics,2010,40(2). |
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| Authors: | LIU Xin XIE Tingming LUO Chi LIU Jianhua TANG Zhe |
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| Affiliation: | Sichuan Institute of Solid-State Circuits/a>;China Electronics Technology Group Corp./a>;Chongqing 400060/a>;P/a>;R/a>;China |
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| Abstract: | 3D-MCM technology based on MCM-D thin film technique was studied,including embedded passive components, chip thinning,stacked die package,low-profile gold wire bonding,chip bump and board-level stacked structure interconnection assembly.The stacked structure of 3D-MCM was obtained by using techniques such as embedded substrate, stacked die package and board-level stacked structure interconnection.3D-MCM samples were prepared.Main process and control methods for key steps were developed.And finally,3D-MCM pa... |
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| Keywords: | 3D-MCM Embedded substrate Stacked structure 3-D stacked structure interconnection |
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