| 印制电路板的清洗技术(一) |
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| 引用本文： | 周志春. 印制电路板的清洗技术(一)[J]. 洗净技术, 2004, 2(6): 42-48 |
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| 作者姓名： | 周志春 |
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| 作者单位： | 电科院电子设计制造一体化中心,北京,100041 |
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| 摘 要： | 文章介绍了印制线路板的焊接制造工艺过程；助焊剂的种类及其在焊接过程中的作用；焊接残留物的主要成分及其对电子线路板的危害；并着重介绍了各种印制电路板清洗技术及其选用时的注意事项。
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| 关 键 词： | 印制电路板 助焊剂 水基清洗 半水基清洗 溶剂清洗 免清洗 |
| 文章编号： | 1672-2248(2004)06-0042-07 |
Cleaning Technology for PCB |
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| ou Zhichun. Cleaning Technology for PCB[J]. , 2004, 2(6): 42-48 |
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| Authors: | ou Zhichun |
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| Abstract: | e article has introduced PCB welding and manufacturing process; categories of fluxes and their functions in welding process; the main composition of welding residue and its harm to PCB; and it has mainly described different PCB cleaning technologies and cautions to be made when selecting. |
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| Keywords: | B welding flux cleaning aqueous-base cleaning semi-aqueous cleaning solvent cleaning no clean technology |
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