| 不同结构参数下PBGA焊点的随机振动分析 |
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| 引用本文： | 崔海坡,程恩清.不同结构参数下PBGA焊点的随机振动分析[J].电子元件与材料,2012,31(2):44-46,50. |
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| 作者姓名： | 崔海坡 程恩清 |
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| 作者单位： | 上海理工大学教育部微创医疗器械工程中心,上海,200093 |
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| 摘 要： | 利用ABAQUS有限元分析软件,对不同结构参数下PBGA焊点的随机振动响应进行了分析。结果表明:在随机振动载荷作用下,PBGA封装焊点的最大应力位于焊点阵列的拐角处,而且在靠近PCB板的一侧;焊点的最大应力值与焊点高度成正比,与焊点直径和焊点间距成反比;当焊点直径为0.66 mm、高度为0.6 mm、间距为1.27 mm时,焊点的最大应力达到最大值842.4 MPa。
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| 关 键 词： | 电子封装 焊点 随机振动 PBGA |
Random vibration analysis of PBGA solder joints with different structure parameters |
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| CUI Haipo
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CHENG Enqing.Random vibration analysis of PBGA solder joints with different structure parameters[J].Electronic Components & Materials,2012,31(2):44-46,50. |
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| Authors: | CUI Haipo CHENG Enqing |
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| Abstract: | The random vibration responses of PBGA solder joints with different structure parameters were analyzed using ABAQUS software. The results indicate that, under the random vibration loading, the maximum stress of PBGA solder joints occurs at the corners of solder joint grid and at the points close to the PCB. The maximum stress of the solder joints is directly proportional to the joint height while inversely proportional to the joint diameter and the distance among the joints. The maximum stress of the solder joints reaches its largest value of 842.4 MPa when the diameter and height of the solder joint and the distance among the solder joints are 0.66 mm, 0.6 mm and 1.27 mm respectively. |
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| Keywords: | electronic package solder joint random vibration PBGA |
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