| 电磁屏蔽填料的制备及研究进展 |
| |
| 引用本文： | 张宁,邵忠财,李晓伟.电磁屏蔽填料的制备及研究进展[J].电镀与精饰,2012,34(3):28-33. |
| |
| 作者姓名： | 张宁 邵忠财 李晓伟 |
| |
| 作者单位： | 沈阳理工大学环境与化学工程学院,辽宁沈阳,110159 |
| |
| 基金项目： | 辽宁省教育厅科技攻关项目(L2010484) |
| |
| 摘 要： | 综述了电磁屏蔽导电复合填料的发展现状,分别介绍了金属系导电填料、碳系导电填料和金属-碳系导电填料的制备及研究进展。进一步分析了三种导电填料的优缺点,并对其进行了比较,同时对未来碳系填充型电磁屏蔽材料的发展趋势提出了建议。
|
| 关 键 词： | 电磁屏蔽 金属系导电填料 碳系导电填料 金属-碳系导电填料 |
Preparation and Researching Progress of Electromagnetic Shielding Packing |
| |
| ZHANG Ning
,
SHAO Zhong-cai
,
LI Xiao-wei.Preparation and Researching Progress of Electromagnetic Shielding Packing[J].Plating & Finishing,2012,34(3):28-33. |
| |
| Authors: | ZHANG Ning SHAO Zhong-cai LI Xiao-wei |
| |
| Affiliation: | (School of Environment and Chemical Engineering,Shenyang Ligong University,Shenyang 110159,China) |
| |
| Abstract: | Developmental status of electromagnetic shielding conductive composite packing was summarized;preparation and researching progress of conductive filler,such as metal for conductive filler、carbon and metal-carbon for conductive filler were introduced;advantages and disadvantages of the three kinds of conductive filler were also analyzed and compared.Meanwhile,developmental trend of carbon for electromagnetic shielding packing in future was put forward. |
| |
| Keywords: | electromagnetic shielding metal for conductive filler carbon for conductive filler metal-carbon for conductive filler |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
