| 电子塑封材料的高温界面强度研究 |
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| 引用本文： | 张旻澍,谢安,李世玮,卢智铨.电子塑封材料的高温界面强度研究[J].电子元件与材料,2012,31(7):67-69. |
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| 作者姓名： | 张旻澍 谢安 李世玮 卢智铨 |
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| 作者单位： | 1. 厦门理工学院材料科学与工程系,福建厦门,361024
2. 香港科技大学先进微系统封装中心,香港 |
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| 基金项目： | 福建省自然科学基金资助项目，教育部人文社科青年基金资助项目 |
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| 摘 要： | 为了研究最常见的电子封装失效模式之一——高温下的界面破坏机理,在传统剪切拉拔实验的基础上进行了改良,运用焊接力测试机(Dage 4000)、拉伸机、热控制仪和热烘箱等辅助仪器,实现了电子塑封材料在高温下的界面强度测试.结果表明,界面强度随着温度的升高而降低,特别是在跨越塑封材料的玻璃转换温度时,界面强度有显著降低.比较...
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| 关 键 词： | 电子塑封材料 高温界面强度 玻璃转换温度 可靠性 |
Study on high temperature interfacial strength of electronic encapsulation materials |
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| ZHANG Minshu
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XIE An
,
RICKY-LEE Shiwei
,
LO C C Jeffry.Study on high temperature interfacial strength of electronic encapsulation materials[J].Electronic Components & Materials,2012,31(7):67-69. |
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| Authors: | ZHANG Minshu XIE An RICKY-LEE Shiwei LO C C Jeffry |
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| Affiliation: | ZHANG Minshu1,XIE An1,RICKY-LEE Shiwei2,LO C C Jeffry2(1.Department of Materials Science and Engineering,Xiamen University of Technology,Xiamen 361024,Fujiang Province,China;2.CAMP Center,The Hong Kong University of Science and Technology,Hong Kong,China) |
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| Abstract: | For studying electronic packaging interfacial cracking mechanism at high temperature,one of the common failure modes in electronic packaging,the interfacial strengths of electronic encapsulation materials at high temperature were tested based on the improved traditional shearing drawing experiment by using the soldering force test machine(Dage 4000),the drawing machine,the temperature controller and the high temperature oven.Results show that the interfacial strength decreases with the temperature increases.Especially,to across the glass transition temperature of the materials the interfacial strength decreases obviously.The strength lost is approaching 95% when the temperature is from 25 ℃ to 260 ℃. |
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| Keywords: | electronic encapsulation material high temperature interfacial strength glass transition temperature reliability |
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