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| BGA器件Z×2101回流过程有限元模拟 | |
| 引用本文： | 陈一豪,刘哲,付红志,方文磊,夏卫生,吴丰顺.BGA器件Z×2101回流过程有限元模拟[J].电子工艺技术,2012,33(2):67-70,78. |
| 作者姓名： | 陈一豪 刘哲 付红志 方文磊 夏卫生 吴丰顺 |
| 作者单位： | 1. 华中科技大学材料成形与模具技术国家重点实验,湖北武汉,430074 2. 中兴通讯股份有限公司物流体系工艺研究部,广东深圳,518057 3. 华中科技大学材料成形与模具技术国家重点实验,湖北武汉430074／华中科技大学武汉国家光电实验室,湖北武汉430074 |
| 基金项目： | 中国一欧盟科技合作基金项目 |
| 摘 要： | 采用间接耦合的方法对BGA（Ball Grid Array）器件ZX2101的回流过程进行有限元模拟,得出回流结束后BGA器件整体、PCB以及芯片基板的温度分布,同时仿真分析了焊球阵列部分的温度分布随时间变化的情况,据此得到回流结束后PCB与芯片基板的变形。在设定的温度边界条件下,得到了四点回流曲线,模拟结果与实测结果相吻合。 |
| 关 键 词： | 球栅阵列 回流过程 有限元模型 温度分布 应力分布 |
Finite Element Modeling of Reflow Process for BGA ZX2101 |
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| CHEN Yi-hao,LIU Zhe,FU Hongzhi,FANG Wen-lei,XIA Wei-sheng,WU Feng-shun.Finite Element Modeling of Reflow Process for BGA ZX2101[J].Electronics Process Technology,2012,33(2):67-70,78. | |
| Authors: | CHEN Yi-hao LIU Zhe FU Hongzhi FANG Wen-lei XIA Wei-sheng WU Feng-shun |
| Affiliation: | 1,3) (1.State Key Laboratory of Materials Processing and Die & Mould Technology of Huazhong University of Science and Technology,Wuhan 430074,China; 2.Zhongxing Telecom Equipment Corporation,Shenzhen 518057,China; 3.Wuhan National Laboratory for Optoelectronics of Huazhong University of Science and Technology,Wuhan 430074,China) |
| Abstract: | Indirect coupling method is applied to simulate the reflow process for the ball grid array(BGA) package ZX2101. Temperature profiles of the whole package,printed circuit board(PCB),and the base board of chip are obtained after the reflow process,as well as the ball array.Based on these temperature profiles,and the deformation of PCB and the base board of chip are simulated.The reflow curve is determined on the given boundary condition of temperature.The simulated results agree well with the experimental. |
| Keywords: | Ball Grid Array Reflow process Finite element modeling Temperature profile Stress profile |
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