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基于LTCC技术的Ku波段金丝线匹配的研究
引用本文:杨海峰,邢孟江.基于LTCC技术的Ku波段金丝线匹配的研究[J].电子元件与材料,2012,31(5):39-41.
作者姓名:杨海峰  邢孟江
作者单位:1. 宝鸡文理学院物理与信息技术系,陕西宝鸡,721016
2. 西安电子科技大学微电子学院,陕西西安,710071
基金项目:宝鸡文理学院重点项目资助(No.ZK10123);国家“863”计划资助项目(No.2009AA01Z260)
摘    要:基于低温共烧陶瓷(LTCC)技术,设计了Ku波段金丝键合线宽带匹配电路,该电路应用多节1/4波长传输线对两根金丝键合线在Ku波段进行了具有二项式响应的宽带匹配。三维电磁场仿真表明,匹配后在Ku波段的回波损耗达到–20 dB以下,有效提高了信号的通过率。该匹配电路在LTCC基板上所占面积小、实现较为简单。

关 键 词:宽带匹配电路  Ku波段  低温共烧陶瓷  金丝键合线

Research of the match circuit based on LTCC technology to gold bonding wire in Ku-band
YANG Haifeng , XING Mengjiang.Research of the match circuit based on LTCC technology to gold bonding wire in Ku-band[J].Electronic Components & Materials,2012,31(5):39-41.
Authors:YANG Haifeng  XING Mengjiang
Affiliation:1.Department of Physics and Information Technology,Baoji University of Arts and Sciences,Baoji 721016,Shaanxi Province,China;2.School of Microelectronics,Xidian University,Xi’an 710071,China)
Abstract:Based on the low temperature co-fired ceramics(LTCC) technology,the broadband match circuit of gold bonding wire in Ku-band was designed.This circuit used the multi-section of quarter-wave transmission lines,which has broadband match of binomial response on two gold bonding wires in Ku-band.The results of 3D electromagnetic field simulations show that the return loss after the match circuit is lower than-20 dB in Ku-band,and the signal pass ratio is increased effectively.The area of the match circuit is small on the LTCC substrate,and whose application is relative simple.
Keywords:broadband match circuit  Ku-band  LTCC  gold bonding wire
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