| SnAgCuRE系钎料合金的润湿特性 |
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| 引用本文： | 杨洁,张柯柯,程光辉. SnAgCuRE系钎料合金的润湿特性[J]. 电子元件与材料, 2008, 27(7) |
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| 作者姓名： | 杨洁 张柯柯 程光辉 |
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| 作者单位： | 南京信息职业技术学院,机电工程系,江苏,南京,210046;河南科技大学,材料科学与工程学院,河南,洛阳,471003;济源职业技术学院,河南,济源,454650 |
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| 摘 要： | 选择商用水溶性钎剂,以润湿平衡法,研究了SnAgCuRE系钎料合金在表面贴装元器件上的润湿特性。结果表明:当w(RE)为0.1%时,预热15s,255℃钎焊5s,该钎料合金具有最大的润湿力1.510mN和最小的润湿角11.03°,与传统的Sn63Pb37钎料的润湿力相当,可满足表面组装元器件对其润湿性能的要求。
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| 关 键 词： | 电子技术 SnAgCuRE钎料 表面贴装元器件 润湿特性 |
Wetting character of SnAgCuRE system solder alloys |
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| YANG Jie,ZHANG Ke-ke,CHENG Guang-hui. Wetting character of SnAgCuRE system solder alloys[J]. Electronic Components & Materials, 2008, 27(7) |
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| Authors: | YANG Jie ZHANG Ke-ke CHENG Guang-hui |
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| Affiliation: | YANG Jie 1,ZHANG Ke-ke 2,CHENG Guang-hui 3 (1.Dept of Electrical , Mechanical Engineering,Nanjing College of Information Technology,Nanjing 210046,China,2. School of Materials Science&Engineering,Henan University of Science&Technology,Luoyang 471003,Henan Province,3.College of Jiyuan Vocational , Technical,Jiyuan 454650,China) |
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| Abstract: | Using commercial water soluble flux,the wetting character of SnAgCuRE system solder alloys on surface mount component and device was investigated by the wetting balance method.The result shows that this solder has the highest wetting force of 1.510 mN and the smallest wetting angle of 11.03°when w(RE)is 0.1%,preheat time is 15 second and soldering time is 5 second at 255℃.This solders can meet the wetting property for requirement of surface mount component and device due to its wetting force is equivalent to traditional Sn63Pb37 solder alloy. |
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| Keywords: | electron technology SnAgCuRE solder surface mount components and device wetting character |
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