The influence of heat treatment and finishing on the mechanical and dielectric properties of glass fabric-epoxy resin laminar composites

The aim of this investigation was to define the optimum conditions of obtaining glass fabric-epoxy resin laminar composites with mechanical and dielectric properties that satisfy the quality needed for production of printed circuit boards for microelectronics. Commercial materials: glass woven fabric, different types of silane finish and epoxy resin were the starting materials in obtaining composites. The conditions needed for the thermal removal of the original size from glass fabric were investigated. The optimal heat treatment should be performed at temperatures less than 550 °C, while cooling rates should be as low as possible. In this manner, the fabric has less than 0.1% of residual size, and the mechanical properties remain satisfactory. Different types of adhesion promoters based on silanes were applied on heat-treated glass fabric as finishes. The quality of the composite material made of thermally and chemically treated glass fabric and epoxy resin was controled by measuring the tensile and dielectric strength of the composite. Depending on which properties of composite are of primary concern, mechanical or dielectric, a finish with an amino functional group and lower heat-treatment temperature or epoxy-modified coatings and higher heat-treatment temperature should be used for obtaining glass-fabric epoxy resin laminar composites.