| 多芯片组件的布线 |
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| 引用本文： | 方易圆,林争辉.多芯片组件的布线[J].微电子学,1996,26(3):184-188. |
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| 作者姓名： | 方易圆 林争辉 |
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| 作者单位： | 上海交通大学大规模集成电路研究所 |
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| 摘 要： | 布线是多芯片组件（ＭＣＭ）ＣＡＤ中的一个关键步骤，由于ＭＣＭ的封装密度很高，因此，因此，其布线问题也较传统的ＩＣ或ＰＣＢ布线更为困难，指出了ＭＣＭ布线中存在的问题，介绍了当前用于ＭＣＭ布线的几种方法，着重讨论了ＳＬＩＣＥ布线法和４通孔布线法，对这几种方法进行了比较，４通孔布线法可直接产生详细布线结果，有利于节省成本和提高布线效率。
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| 关 键 词： | 多芯片组件 计算机辅助设计 布线 |
Routing Techniques for Multichip Modules |
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| FANG Yiyuan and LIN Zhenghui.Routing Techniques for Multichip Modules[J].Microelectronics,1996,26(3):184-188. |
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| Authors: | FANG Yiyuan and LIN Zhenghui |
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| Abstract: | Routing is a key procedure in the computer-aided-design of multi-chip modules (MCM's). Due to the high density of MCM packages, the routing for MCM's is much more difficult than that for tradiional IC's or PCB's. Problems with MCM routing are pointed out. Current techniques for MCM routing are described, with emphasis on SLICE routing and 4-via routing. It is demonstrated that the 4-via routing can generate detailed routing topologies, thus saving the cost and improving efficiency. |
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| Keywords: | Multi-Chip module Computer-aided-design Routing SLICE routing 4-Via routing |
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