| SMT中钎焊工艺的可靠性 |
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| 引用本文： | 谈侃侃. SMT中钎焊工艺的可靠性[J]. 微电子学, 1996, 26(5): 348-349 |
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| 作者姓名： | 谈侃侃 |
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| 作者单位： | 电子工业部第２４研究所 |
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| 摘 要： | 随着对电子产品性能要求的不断提高，ＳＭＴ技术中钎焊的可靠性变得越来越重要。分析了焊膏的组份和钎焊机理，探讨了影响ＳＭＴ钎焊可靠性的主要因素。提出了相应的改进措施。
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| 关 键 词： | 电子组装 SMT 钎焊 可靠性 |
The Reliability of Soldering in Surface Mount Technology |
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| TAN Kankan Sichuan Institute of Solid State Circuits,Chongqing. The Reliability of Soldering in Surface Mount Technology[J]. Microelectronics, 1996, 26(5): 348-349 |
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| Authors: | TAN Kankan Sichuan Institute of Solid State Circuits Chongqing |
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| Affiliation: | TAN Kankan Sichuan Institute of Solid State Circuits,Chongqing,630060 |
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| Abstract: | With the increasing demand on the performance of electronic products,the reliability of soldering in SMT has become ever more important.The composition of soldering paste and the soldering mechanism are analyzed.Major factors affecting the reliability of soldering in SMT are discussed,and corresponding measures for improvement are presented. |
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| Keywords: | Electronic assembly SMT Reliability Soldering |
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