| 基于蒙特卡罗法的QFN器件可靠性灵敏度分析 |
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| 引用本文： | 李永利,周德俭,黄红艳. 基于蒙特卡罗法的QFN器件可靠性灵敏度分析[J]. 电子元件与材料, 2009, 28(5). DOI: 10.3969/j.issn.1001-2028.2009.05.021 |
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| 作者姓名： | 李永利 周德俭 黄红艳 |
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| 作者单位： | 1. 桂林电子科技大学,机电工程学院,广西,桂林,541004
2. 桂林电子科技大学,机电工程学院,广西,桂林,541004;广西工学院,机械工程系,广西,柳州,545006 |
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| 摘 要： | 采用有限元软件,在热循环加载条件下,对四角扁平无引脚封装(QFN,Quad Flat No-lead Package)器件进行了热疲劳可靠性分析。选取PCB焊盘长度等几个因素作为灵敏度分析的输入变量,热疲劳寿命作为输出变量。结果表明:影响QFN器件热疲劳寿命的主要因素依次是焊盘长度、焊盘宽度和焊盘弹性模量等,其灵敏度值分别为:–6.4848×10–1,6.0606×10–1和6.0000×10–1等。提出了提高QFN器件可靠性的方法。
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| 关 键 词： | 蒙特卡罗法 QFN 可靠性 |
Reliability sensitivity analysis of the QFN device based on Monte Carlo method |
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| LI Yongli,ZHOU Dejian,HUANG Hongyan. Reliability sensitivity analysis of the QFN device based on Monte Carlo method[J]. Electronic Components & Materials, 2009, 28(5). DOI: 10.3969/j.issn.1001-2028.2009.05.021 |
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| Authors: | LI Yongli ZHOU Dejian HUANG Hongyan |
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| Affiliation: | 1. School of Mechanical and Electrical Engineering;Guilin University of Electronic Technology;Guilin 541004;Guangxi Zhuangzu Zizhiqu;China;2. Department of Mechanical Engineering;Guangxi University of Technology;Liuzhou 545006;China |
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| Abstract: | By using the finite element software, the thermal fatigue reliability of QFN (Quad Flat No-lead Package) device was analyzed under thermal cycling loading condition. Some factors such as PCB bonding pad length for example were considered as input variables, and the thermal fatigue life was considered as output variable. Results show that the prominent factors influencing the thermal fatigue life of QFN device are in order of the bonding pad length, the bonding pad width, elastic modulus of the bonding pad, ... |
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| Keywords: | QFN |
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