| 电镀双极化现象浅析 |
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| 引用本文： | 杨智勤,倪超,田瑞杰,陆然,张曦.电镀双极化现象浅析[J].印制电路信息,2012(5):26-27,38. |
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| 作者姓名： | 杨智勤 倪超 田瑞杰 陆然 张曦 |
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| 作者单位： | 深南电路有限公司,广东深圳,518117 |
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| 摘 要： | 主要论述了电镀过程中的双极化现象及阐明其发生机理,并据此提出避免双极化的措施。
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| 关 键 词： | 双极化 机理 改善措施 |
Analysis of the bipolarization phenomena in plating process |
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| YANG Zhi-qin,NI Chao,TIAN Rui-jie,LU Ran,ZHANG Xi.Analysis of the bipolarization phenomena in plating process[J].Printed Circuit Information,2012(5):26-27,38. |
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| Authors: | YANG Zhi-qin NI Chao TIAN Rui-jie LU Ran ZHANG Xi |
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| Affiliation: | YANG Zhi-qin NI Chao TIAN Rui-jie LU Ran ZHANG Xi |
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| Abstract: | This article mainly introduced the bipolarization phenomena in plating process and its generation mechanism,from which some improvement solution is given. |
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| Keywords: | bipolarization phenomena mechanism improvement solution |
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