| 细密线路加工工艺研究 |
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| 引用本文： | 刘海龙.细密线路加工工艺研究[J].印制电路信息,2012(5):42-47. |
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| 作者姓名： | 刘海龙 |
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| 作者单位： | 深南电路有限公司,广东深圳,518053 |
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| 摘 要： | 结合行业发展趋势以及在PCB加工过程中的实战经验,通过生产数据总结和试验研究,对细密线路加工影响因素进行了系统全面的分析,从加工工艺、设备选择、物料选择等多纬度进行分析和试验验证,总结出一套适合PCB细密线路生产的解决方案。
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| 关 键 词： | 高密度 图形 电镀 蚀刻 对位 |
Research on super fine line and space production |
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| LIU Hai-long.Research on super fine line and space production[J].Printed Circuit Information,2012(5):42-47. |
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| Authors: | LIU Hai-long |
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| Affiliation: | LIU Hai-long |
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| Abstract: | Referring to the development of PCB industry and experience on PCB manufacturing and according to the producing and experiment＇s data,we got a systemic analysis on high density space product production process.This thesis describes the production method on many points of view such as equipment＇s selecting and material＇s selecting.Finally we summarize a series of feasible solutions on high density PCB production. |
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| Keywords: | high density PCB imagine plating etching registration |
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