| 导通孔电镀铜填充技术 |
| |
| 引用本文： | 蔡积庆.导通孔电镀铜填充技术[J].印制电路信息,2012(5):28-32. |
| |
| 作者姓名： | 蔡积庆 |
| |
| 作者单位： | 江苏南京,210018 |
| |
| 摘 要： | 概述了下一代PCB用镀铜层导通孔填充技术。
|
| 关 键 词： | 导通孔填充 贯通孔填充 镀铜层 添加剂 智能电话 |
Copper plating via filling technology |
| |
| CAI Ji-qing.Copper plating via filling technology[J].Printed Circuit Information,2012(5):28-32. |
| |
| Authors: | CAI Ji-qing |
| |
| Affiliation: | 江苏南京,210018 |
| |
| Abstract: | This paper describes via filling technology with capper plating for next generation printed circuit board（PCB）. |
| |
| Keywords: | Via filling Through hole filling Copper plating Additive Smartphone |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
