全自动金丝球焊机的CAD/CAE设计研究

全自动金丝球焊机是微电子封装设备中的核心设备,它是集精密机械、自动控制、图像识别、计算机应用、光学、超声波焊接等多领域技术于一体的现代高技术微电子生产设备.工作原理是通过X-Y工作台和焊头的三维运动控制,定位并拉出设定的金丝线型,采用超声波热压球焊方法焊接芯片管脚.技术路线是应用光机电一体化技术和采用CAD/CAE技术手段进行研制与开发.超声球焊和高速高精度运动定位技术是关键技术.为使球焊机达到高速高精度焊接的要求,应用CAD/CAE技术对球焊机关键部件X-Y工作台及焊头进行CAD建模的概念设计、有限元力学分析和结构优化设计.

Research on the design of a fully automatic gold wire bonder with CAD/CAE

Fully automatic gold wire bonder is the key device of the package equipment for micro-electrons, which is associated with integrating technologies of fine mechanics, automatic control, image recognition, computer application, optics and ultrasonic wave bond. By controling three-dimensional motion of the X-Y table and bond head, precision positioning and desired line-type gold wires can be realized, and an ultrasonic wave bonded method is used. The technology route is to use integrating technologies of optics and mechatronics as well as CAD/CAE to develop new products. Ultrasonic wave bond and precision position at high speed are key technologies. By means of CAD/CAE technology, The solid models of the X-Y table and bond head assembly were built, and based on the solid models, the mechanism simulation was done. By using finite element method(FEM), the structural analysis will be done for improving design to meet the demand of bonding precision and speed.