A new asymmetrical halo source GOLD drain (HS-GOLD) deepsub-half-micrometer n-MOSFET design for reliability and performance |
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Authors: | Buti TN Ogura S Rovedo N Tobimatsu K |
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Affiliation: | IBM E. Fishkill Lab., Hopewell Junction, NY; |
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Abstract: | An asymmetrical n-MOSFET device structure was developed that is suitable, in terms of reliability and performance, for scaling down to the sub-quarter-micrometer level without reduction of the supply voltage below 3.5 V. In this structure, large-tilt implantation is used to form the gate-overlapped LDD (GOLD) region at the drain electrode only. A halo (punchthrough stopper) is used at the source, but not at the drain. Superior hot carrier reliability and high punchthrough resistance are obtained using this device structure. A reliability-limited supply voltage of 4.2 V is obtained for an asymmetrical n-MOSFET with effective channel lengths as short as 0.25 μm. By extrapolation from the measured threshold roll-off characteristics, the authors expect that this structure can be designed with substantially shorter channel length while maintaining the 3.5-V supply voltage |
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