| 无铅焊料Sn-Zn-In系列合金的研究 |
| |
| 引用本文： | 袁宜耀,孙勇.无铅焊料Sn-Zn-In系列合金的研究[J].电子元件与材料,2007,26(8):39-41. |
| |
| 作者姓名： | 袁宜耀 孙勇 |
| |
| 作者单位： | 昆明理工大学,云南省新材料制备与加工重点实验室,云南,昆明,650093 |
| |
| 摘 要： | 对熔化起始温度和终止温度作线性回归进行合金设计,并对其焊料合金进行了熔点、抗剪切强度及微观组织等研究分析。结果表明:当w(In)(质量分数)为3%~5%,w(Zn)为5%~9%时,焊料的熔化温度在170~200℃,接近于焊料Sn-37Pb的熔化温度183℃;焊料与Cu焊合后形成γ-Cu5Zn8化合物;Sn-Zn-In系焊料的抗剪切强度与焊料Sn-37Pb的剪切强度33.73 MPa相当。
|
| 关 键 词： | 金属材料 无铅焊料 Sn-Zn-In系 熔点 剪切强度 |
| 文章编号： | 1001-2028（2007）08-0039-03 |
| 修稿时间： | 2007-03-28 |
Research of Sn-Zn-In lead-free based solders |
| |
| YUAN Yi-yao,SUN Yong.Research of Sn-Zn-In lead-free based solders[J].Electronic Components & Materials,2007,26(8):39-41. |
| |
| Authors: | YUAN Yi-yao SUN Yong |
| |
| Affiliation: | Kunrning University of Science and Technology, Key Laboratory of Advanced Materials of Yunnan Province, Kunming 650093, China |
| |
| Abstract: | The optimal composition of Sn-Zn-In lead-free solders was studied through linear regress the starting and ending temperature.In addition,melting point,shearing strength,and microstructure of solders was analyzed.The results show that melting temperature is between 170~200 ℃ and near the lead-free solders melting temperature 183 ℃ when the percent of In between 3 %~5 %,and Zn between 5 %~9 %.Solders and Cu composed γ-Cu5Zn8 after soldering.Shearing strength of Sn-Zn-In is almost equal to 33.73 MPa of Sn-37Pb solders. |
| |
| Keywords: | metallic material lead-free solders Sn-Zn-In system melting point shearing strength |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
