Mechanical,thermal, and dielectric properties of SiCf/SiC composites reinforced with electrospun SiC fibers by PIP |
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| Affiliation: | 1. Shenzhen Engineering Lab for Supercapacitor Materials, Shenzhen Key Laboratory for Advanced Materials, School of Material Science and Engineering, Harbin Institute of Technology, Shenzhen, University Town, Shenzhen, 518055, China;2. Songshan Lake Materials Laboratory Dongguan, Guangdong, 523808, China;1. HX5, LLC. NASA Glenn Research Center, Materials and Structures Division, 21000 Brookpark Road, Cleveland, OH, 44135, United States;2. NASA Glenn Research Center, Materials and Structures Division, 21000 Brookpark Road, Cleveland, OH, 44135, United States;1. Science and Technology on Thermostructural Composite Materials Laboratory, Northwestern Polytechnical University, 710072, Xi''an, China;2. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, 710072, Xi''an, China;1. State Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha, Hunan, 410083, PR China;2. Hunan Province Key Laboratory of New Specialty Fibers and Composite Material, Central South University, Changsha, Hunan, 410083, PR China;3. Powder Metallurgy Research Institute, Central South University, Changsha, Hunan 410083, PR China;4. School of Naval Architecture, Ocean and Civil Engineering, Shanghai Jiaotong University, No. 800, Dongchuan Road, Minhang District, Shanghai 200240, PR China;5. College of Civil Aviation, Nanjing University of Aeronautics and Astronautics, No. 29, Jiangjun Ave., Nanjing 211106, PR China |
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| Abstract: | Electrospun unidirectional SiC fibers reinforced SiCf/SiC composites (e-SiCf/SiC) were prepared with ∼10% volume fraction by polymer infiltration and pyrolysis (PIP) process. Pyrolysis temperature was varied to investigate the changes in microstructures, mechanical, thermal, and dielectric properties of e-SiCf/SiC composites. The composites prepared at 1100 °C exhibit the highest flexural strength of 286.0 ± 33.9 MPa, then reduced at 1300 °C, mainly due to the degradation of electrospun SiC fibers, increased porosity, and reaction-controlled interfacial bonding. The thermal conductivity of e-SiCf/SiC prepared at 1300 °C reached 2.663 W/(m∙K). The dielectric properties of e-SiCf/SiC composites were also investigated and the complex permittivities increase with raising pyrolysis temperature. The e-SiCf/SiC composites prepared at 1300 °C exhibited EMI shielding effectiveness exceeding 24 dB over the whole X band. The electrospun SiC fibers reinforced SiCf/SiC composites can serve as a potential material for structural components and EMI shielding applications in the future. |
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| Keywords: | electrospun SiC fibers mechanical and thermal properties dielectric properties EMI |
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