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Changes in the tensile strength and fracture mode with thickness of electrodeposited copper foil |
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| Authors: | Dong Nyung Lee Jeom -shik Yang Soo -young Kang |
| Affiliation: | (1) Division of Materials Science Engineering, and Center for Thin Film Fabrication and Crystal Growing of Advanced Materials, Seoul National University, 151-742 Seoul, Korea;(2) Iljin Copper Foil Co., Ltd., 827 Palbong-dong, 570-300 Iksan City, Korea;(3) Daewoo Motor Co., Ltd., Inchon, Korea |
| Abstract: | The tensile strength and fracture mode changed with thickness of copper foil obtained from an acid copper sulfate bath under a same electrodeposition condition. The tensile strength decreased with increasing foil thickness due to an increase in average grain size of the foil. The tensile fracture mode changed from fractures normal to tensile axis to inclined fractures with increasing film thickness. The phenomena have been discussed based on a hardness distribution along the thickness and the local necking and fracture strains. |
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