锡膏固晶与铝片焊线工艺应用于功率及分立器件封装

对于许多单双芯片的MOSFET封装于像SC-70、SOT-2X、TO-252、SOP-8L、TSSOP-8L、QFN等形式的器件来说,标准的固晶工艺如:银浆、软焊料加上金丝、铝丝焊的工艺方法已不能同时满足连续的成本压缩要求和提升封装器件本身的性能。2年来,通过与当地著名的客户和设备供应商的合作,晶微科技有限公司已经开发出了一款新的高温锡膏快速固化机,用以实现这种锡膏固晶的工艺。这种工艺与银浆工艺相比在产品阻抗值及产品因热而导致阻抗漂移问题方面能够得到极好的结果;比起软焊料固晶工艺,在产能和设备应用效率上优越很多,这种新的工艺能带来了相当积极的影响。换言之,这种工艺能把固晶产量相应地提高60%～70%,以非常低的生产成本实现了多种多样的固晶封装形式。

New Solder Paste Die Attach and AI Ribbon Bonding Process for Discrete Power Package Assembly

For some single and dual dies MOSFET device packaged in looks like SC-70,SOT-2X, TO252,SOP-8L,TSSOP-8L,QFN and so on,the standard assembly process for die attach such as Epoxy,Soft solder with Au or Al wire bonding are not enough for satisfying the requirement of continual cost reduction vice versa higher package performance.Since two years,through have cooperated with a local well-known customer and equipment suppliers,Micro-power Semiconductor Ltd (MPS) have developed a new Solder Paste Die Attach process by using high Temperature Solder Snap Cure Oven.The result is extremely good in term of better RDSon,excellent device performance as comparing with conventional Epoxy and Soft solder die attach process.The most important,it brings out many other positive influences by representing of higher productivity and manufacturability.In the other words,it enhances correspondingly the throughput by 60-70% and realizes package versatility for Die Attach process with much lower manufacturing cost.