| 低银无铅焊料润湿及可靠性能研究 |
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| 引用本文： | 符永高,王宏芹,王玲,杜彬,王鹏程,万超,宋志伟.低银无铅焊料润湿及可靠性能研究[J].电子工艺技术,2010,31(6). |
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| 作者姓名： | 符永高 王宏芹 王玲 杜彬 王鹏程 万超 宋志伟 |
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| 作者单位： | 中国电器科学研究院;深圳华为技术有限公司; |
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| 基金项目： | 广东省科技计划项目，广东省重大专项，广东省粤港关键领域招标项目 |
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| 摘 要： | 利用润湿测量法研究了低银无铅焊料SAC0307、SAC0507和SAC0807的润湿性能,发现上述低银焊料润湿性能几乎相同.通过波峰焊接实验鉴定了其溶解铜焊盘性能,发现所做短时间溶铜实验中上述低银焊料的低银焊料的溶铜速度几乎相同.温度循环实验后检测了金属间化合物生长及裂纹发生情况,确定低银无铅焊料SAC0807裂纹萌生率最低.所作实验研究中皆采用共晶锡银焊料SAC305作为参照焊料.
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| 关 键 词： | 低银焊料 润湿 溶解 裂纹 |
Investigation on wetting and reliability of low Ag lead free solders |
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| FU Yong-gao,WANG Hong-qin,WANG Ling,DU Bin,WANG Peng-cheng,WAN Chao,SONG Zhi-wei.Investigation on wetting and reliability of low Ag lead free solders[J].Electronics Process Technology,2010,31(6). |
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| Authors: | FU Yong-gao WANG Hong-qin WANG Ling DU Bin WANG Peng-cheng WAN Chao SONG Zhi-wei |
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| Affiliation: | FU Yong-gao1,WANG Hong-qin1,WANG Ling1,DU Bin1,WANG Peng-cheng1,SONG Zhi-wei2(1.China National Electric Apparatus Research Institute,Guangzhou 510300,China 2.Huawei Technologies Co.,Ltd,Shenzhen,518129,China) |
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| Abstract: | The wetting properties of the low Ag lead free solders SAC0307,SAC0507,SAC0807 were investigated using the wetting balance test.It was found that the above-mentioned low Ag lead free solders showed almost the same wetting properties.The dissolution of Cu pad in these lead free solders during the short time wave soldering was tested and the dissolution rates were at the same level.The IMC growth and the crack were checked after the thermal cycling test and the SAC0807 solder showed the lowest ratio of the cr... |
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| Keywords: | low Ag solder wet dissolution crack |
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