|
|||||
|
|
Effects of Ti addition and heat treatments on mechanical and electrical properties of Cu-Ni-Si alloys |
|
| Authors: | Hyung Giun Kim Taeg Woo Lee Sang Min Kim Seung Zeon Han Kwangjun Euh Won Yong Kim Sung Hwan Lim |
| Affiliation: | 1. Department of Advanced Materials Science and Engineering, Kangwon National University, Chuncheon, 200-701, Korea 2. Structural Materials Division, Korea Institute of Materials Science, Changwon, 642-831, Korea 3. Gangwon Regional Division, Korea Institute of Industrial Technology, Gangneung, 210-340, Korea |
| Abstract: | The mechanical and electrical properties of Cu-5.98Ni-1.43Si and Cu-5.98Ni-1.29Si-0.24Ti alloys under heat treatment at 400 and 500 °C after hot- and cold-rolling were investigated, and a microstructural analysis using transmission electron microscopy was performed. Cu-5.98Ni-1.29Si-0.24Ti alloy displayed the combined Vickers hardness/electrical conductivity value of 315.9 Hv/57.1%IACS. This was attributed to a decrease of the solution solubility of Ni and Si in the Cu matrix by the formation of smaller and denser δ-Ni2Si precipitates. Meanwhile, the alloyed Ti was detected in the coarse Ni-Si-Ti phase particles, along with other large Ni-Si phase particles, in Cu-5.98Ni-1.29Si-0.24Ti. |
| Keywords: | |
| 本文献已被 SpringerLink 等数据库收录！ | |