| 板级跌落碰撞下无铅焊点的有限元分析 |
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| 引用本文： | 刘芳,孟光,赵玫,赵峻峰. 板级跌落碰撞下无铅焊点的有限元分析[J]. 振动与冲击, 2008, 27(2): 75-77 |
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| 作者姓名： | 刘芳 孟光 赵玫 赵峻峰 |
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| 作者单位： | 1. 上海交通大学机械系统与振动国家重点实验室,上海,200240
2. 英特尔技术研发(上海)有限公司,上海,200131 |
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| 基金项目： | 英特尔与高校合作基金 , 高等学校学科创新引智计划 |
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| 摘 要： | 为了预测跌落碰撞下球栅阵列(BGA)封装中无铅焊点的失效,采用ABAQUS软件来模拟跌落碰撞过程中焊点的应力分布.首先建立圆形电路板(PCB)组件的有限元模型,接着用模态试验和有限元模拟相结合的方法确定有限元模型的边界条件和PCB的阻尼参数,然后运用ABAQUS有限元软件模拟PCB组件从三种高度下跌落碰撞过程中BGA封装中无铅焊点的拉应力分布.结果表明:封装最外圈四个拐角焊点的拉应力最大,最大拉应力出现在焊点靠近封装的一侧.由此预测最外圈拐角的焊点最易失效,焊点失效的位置在靠近封装一侧.
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| 关 键 词： | 跌落碰撞 无铅焊点 有限元分析 板级 跌落碰撞 无铅焊点 有限元分析 Impact Drop Level Board Joints Solder Element Analysis 位置 焊点失效 最大拉应力 外圈 结果 高度 软件模拟 运用 阻尼参数 |
| 收稿时间： | 2007-06-19 |
| 修稿时间： | 2007-07-17 |
Finite Element Analysis for Lead-Free Solder Joints under a Board Level Drop Impact |
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| LIU Fang,MENG Guang,ZHAO Mei,ZHAO Jun-feng. Finite Element Analysis for Lead-Free Solder Joints under a Board Level Drop Impact[J]. Journal of Vibration and Shock, 2008, 27(2): 75-77 |
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| Authors: | LIU Fang MENG Guang ZHAO Mei ZHAO Jun-feng |
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| Abstract: | In order to predict failure location of BGA lead-free solder joints under a drop impact,ABAQUS software is used to analysis stress distribution of the solder joints.Firstly,finite element(FE) model of a round printed circuit board(PCB) assembly is established.Secondly,a modal test is combined with FE analysis to determine the damping parameters and the boundary condition of the finite element model.Finally,ABAQUS software is used to analyze the stretching stress distribution of the BGA lead-free solder joint when the round PCB assembly is droped from three different drop heights respectively.Results show that the maximum stretching stress occurs at the solder joints located at four outermost corners.It can be predicted from stress distributions that the solder joints at outermost corners are prone to being fractured. |
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| Keywords: | drop impact lead-free solder joint finite element analysis |
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