首页 | 本学科首页   官方微博 | 高级检索  
     

薄壁注塑件翘曲的正交分析及优化
引用本文:阮育煌,肖民,汪莉娟.薄壁注塑件翘曲的正交分析及优化[J].机电工程技术,2012(11):5-8.
作者姓名:阮育煌  肖民  汪莉娟
作者单位:东莞市奕东电子有限公司
摘    要:分析了注塑制件翘曲的原因,采用著名的CAE软件Moldnow与正交试验方法,对不同工艺条件下的注塑成型过程进行模拟分析并对正交实验数据进行极差分析,确定注射时间、保压压力、保压时间、冷却时间、熔体温度、模具温度以及冷却液温度等注塑成型工艺参数对制件翘曲变形的影响程度,得出最优的注塑成型工艺参数组合,并以一薄壁导光板对该工艺组合方案进行模拟验证与实际注塑实验验证。

关 键 词:薄壁注塑成型  薄壁导光板  翘曲变形  CAE分析  正交实验

The Orthogonal Experiment Analysis and Optimization of Warpage of the Thin-Wall Injection Molding Part
RUAN Yu-huang,XIAO Min,WANG Li-juan.The Orthogonal Experiment Analysis and Optimization of Warpage of the Thin-Wall Injection Molding Part[J].Mechanical & Electrical Engineering Technology,2012(11):5-8.
Authors:RUAN Yu-huang  XIAO Min  WANG Li-juan
Affiliation:(Dongguan Yidong Electronic Co.,Ltd.,Dongguan523120,China)
Abstract:This article analyzes the factors of warpage, using Moldflow and orthogonal experiment to simulate the injection molding process with different technology parameters, and using range analysis way to gain the different effect degree from injection time, holding pressure, holding time, cooling time, melt temperature, mold temperature and the coolant inlet temperature to the warpage of injection molding part, getting the optimality injection molding parameters, and using CAE simulation and experiment to verify the parameters with a thin-wall light guide plate.
Keywords:thin-wall injection molding  thin light guide plate  warpage  CAE analysis  orthogonal experiment
本文献已被 CNKI 维普 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号