| 环氧电工塑料的固化反应动力学研究 |
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| 引用本文： | 程鹏,吕建,王建,徐晓伟.环氧电工塑料的固化反应动力学研究[J].热固性树脂,2009,24(3). |
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| 作者姓名： | 程鹏 吕建 王建 徐晓伟 |
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| 作者单位： | 桂林工学院材料与化学工程系有色金属及材料加工新技术教育部重点实验室,广西桂林,541004 |
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| 基金项目： | 国家自然科学基金，广西自然科学基金 |
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| 摘 要： | 以双马来酰亚胺(BMI)/二氨基二苯砜(DDS)为组合固化剂,采用非等温示差扫描量热法(DSC)研究了邻甲酚醛环氧树脂(ECN)/DDS/BMI三元体系的固化反应动力学,用Kissinger法和Crane公式进行DSC数据处理,获得了固化反应动力学参数,并建立了固化动力学模型,同时结合红外光谱分析探讨了该体系的反应机理。结果表明,ECN/DDS/BMI体系固化反应级数n=0.93;表观活化能Ea=58.2 kJ/mol,与ECN/DDS体系相差很小,BMI的加入对体系的固化工艺影响不大,ECN/DDS/BMI体系的固化动力学模型与ECN/DDS体系相似。
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| 关 键 词： | 环氧塑料 双马来酰亚胺 固化反应动力学 |
Study on the curing reaction kinetics of epoxy electrician molding compound |
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| CHENG Peng,LV Jian,WANG Jian,XU Xiao-wei.Study on the curing reaction kinetics of epoxy electrician molding compound[J].Thermosetting Resin,2009,24(3). |
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| Authors: | CHENG Peng LV Jian WANG Jian XU Xiao-wei |
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| Abstract: | The o-cresol novolac epoxy resins(ECN was cured with bismaleimide(BMI/ 4,4′-diaminodiphenylsulfone(DDS compound.The curing reaction kinetics of ECN/DDS/BMI was studied by differential scanning calorimetry(DSC.Curing reaction kinetic parameters were obtained by data processing of Kissinger method and Crane formula and a model for ECN/DDS/BMI system was set up.The reaction mechanism was discussed by Fourier transform infrared.The results showed that the curing reaction order n=0.93,the apparent activation energy Ea=58.2 kJ/mol,which were nearly the same as that of ECN/DDS system.The addition of BMI had little effect on the curing technology of this system.The curing kinetic model of ECN/DDS/BMI was similar to that of ECN/DDS. |
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| Keywords: | epoxy molding compound ECN BMI curing reaction kinetics |
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