用于大功率激光二极管列阵的硅基微通道热沉研制

将田口稳健设计方法用于面向大功率激光二极管列阵的硅基屋脊式微通道热沉的优化设计，利用正交试验和信噪比分析实现了参数的稳健优化。采用激光二极管条对样品进行了封装和测试。利用砷化镓激光波长的温度漂移系数估算出了中间的激光二极管条的有源区温升。测试结果表明，该微通道热沉的单位面积热阻约为0.070 K•cm2/W，与有限元分析结果基本一致。

A Silicon microchannel heat sink for high-power laser diode arrays

Taguchi robust design method is applied to the design of silicon roof-like microchannel heat sinks. Orthogonal experiments are designed and signal-noise ratios calculated to carry out the robust optimization of key parameters. Laser diode bars are welded on a prototype heat sink to test its thermal resistance. The active region temperature rise of the middle bar is estimated using the temperature coefficient of GaAs laser wavelength. Experimental results show that the thermal resistance per unit area is 0.070 K•cm2/W, which agrees with that calculated with the finite element method.