| Creep behavior on Ag particle reinforced SnCu based composite solder joints |
| |
| 作者单位： | School of Materials Science and Engineering Henan University of Science and Technology，School of Materials Science and Engineering，Henan University of Science and Technology，School of Materials Science and Engineering，Henan University of Science and Technology，School of Materials Science and Engineering，Henan University of Science and Technology，School of Materials Science and Engineering，Henan University of Science and Technology，Luoyang 471003，China，Luoyang 471003，China，Luoyang 471003，China，Luoyang 471003，China，Luoyang 471003，China |
| |
| 基金项目： | Project（2004-294） supported by the Innovative Ability Foundation of Henan Province, China |
| |
| 摘 要： | 1 Introduction The EU had issued the WEEE mandate that aimed to prohibit the use of SnPb solders by 2006. Under the pressure of legislation and trade competitions, large electronic manufacturers and research institutes studied substitutes for SnPb solders…
|
| 关 键 词： | 复合焊料 SnCu 蠕变断裂 应力 银 |
| 收稿时间： | 2005-12-01 |
| 修稿时间： | 2006-03-12 |
Creep behavior on Ag particle reinforced SnCu based composite solder joints |
| |
| Authors: | YAN Yan-fu ZHU Jin-hong CHEN Fu-xiao HE Jun-guang YANG Di-xin |
| |
| Affiliation: | 1. KU Leuven, Department of Materials Engineering, Kasteelpark Arenberg 44, B-3001 Leuven, Belgium;2. SCK?CEN, Boeretang 200, B-2400 Mol, Belgium;1. School of Electronics Engineering, Chungbuk National University, Cheongju 28644, South Korea;2. Nano Convergence Practical Application Center, Daegu Technopark, Daegu 42716, South Korea;1. Semiconductor Department, Materials and Energy Research Center, Karaj, Iran;2. Nanotechnology and Advanced Materials Department, Materials and Energy Research Center, Karaj, Iran;3. Material Engineering Department, University of Tarbiat Modares, Tehran, Iran;1. Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary;2. Department of Microelectronics, Institute of Electron Technology, Krakow, Poland;3. Department of Materials and Semiconductor Structures Research, Institute of Electron Technology, Warsaw, Poland;4. Department of Electrotechnology, Czech Technical University in Prague, Prague, Czech Republic |
| |
| Abstract: | SnCu solder is one of the most promising substitutes of SnPb solder, but its creep resistance is worse than that of the other lead-free solders. Particle-reinforcement is a way to improve the creep resistance of solder alloys and cause much more attention than before. A novel Ag particles reinforced SnCu based composite solder is formed and the influence of stress on creep behavior of the composite solder is investigated. Results indicate that the creep resistance of solder joints is superior to that of the SnCu solder joints. Creep rupture lifetime of solder joints decreases gradually with stress increasing. And the creep rupture lifetime of the composite solder joints falls down faster than that of the matrix solder joints. |
| |
| Keywords: | composite solder particle-reinforcement SnCu creep rupture life stress |
| 本文献已被 CNKI 维普 万方数据 ScienceDirect 等数据库收录！ |
|
