工艺参数对IC10单晶TLP接头组织和性能的影响

采用自制镍基非晶合金箔带KNi3A，在1 240℃对IC10单晶进行过渡液相扩散连接.利用扫描电镜对接头组织进行观察和分析，研究了不同焊接参数下获得的焊缝组织，并对接头进行了高温拉伸和高温持久性能测试.结果表明，当焊缝间隙为0.04 mm时保温10 h，接头组织与母材相同，接头高温力学性能良好；焊缝间隙为0.04 mm保温6 h和焊缝间隙为0.08 mm保温10 h时，无法获得完全等温凝固组织的接头，接头中存在共晶组织和化合物相，接头高温力学性能较差.

Influence of process parameters on microstructure and properties of IC10 single crystal TLP joints

IC10 single crystal superalloy was TLP bonded at 1 240℃ using nickel base amorphous foils, KNi3A. Microstructures of joints bonded with different parameters were studied using scanning electron microscopy. High temperature tensile test and creep rupture property test were performed. Results revealed that, joints with 0.04 mm gap bonded at 1 240℃ for 10 hours share similar microstructure with base metal and have excellent mechanical properties. When it comes to joints with 0.04 mm gap bonded for 6 hours or joints with 0.08 mm gap bonded for 10 hours, there were eutectics and compounds in the joints and the property weaken sharply due to a not completed isothermal solidification.