脉冲负偏压对TiN-Cu复合膜结构与性能的影响

为了研究薄膜的生长过程对薄膜结构和性能的影响并促进该类薄膜的商业应用,利用电弧离子镀在不同脉冲负偏压下沉积了TiN-Cu复合膜,并对其表面形貌、晶体结构、能谱、硬度、结合强度和耐磨性进行研究.结果表明,在50~300 V范围内,随脉冲负偏压值增加,沉积薄膜中Cu原子分数逐渐减少;薄膜中最大的Cu原子分数低于Cu-Ti合金靶中Cu原子分数.沉积膜中TiN相存在明显的(111)晶面织构,并且脉冲负偏压值增大,薄膜的织构程度增加.脉冲负偏压值增加,沉积的TiN-Cu复合膜的硬度和耐磨性降低,但结合强度增加.沉积膜结构与性能的变化与脉冲偏压引起薄膜中Cu原子分数的变化有一定关系.

Influence of negative pulse bias on structure and properties of TiN-Cu composite films

In order to study the influence of growth process of films on their structure and properties and promote their commercial application, the TiN-Cu composite films were prepared under various negative pulse bias by arc ion plating technology, and the surface morphology, crystal structure, energy spectrum, hardness, adhesion strength and wear resistance of the deposited films were investigated. The results show that the Cu atom fraction in the deposited films gradually decreases with increasing the negative pulse bias in the range of 50 V to 300 V. The maximum Cu atom fraction in the films is lower than that in the Cu-Ti alloy target. The obvious(111)plane texture exists for the TiN phase in deposited films, and the degree of texture enhances with increasing the negative pulse bias. With increasing the negative pulse bias, the hardness and wear resistance of deposited TiN-Cu composite films decreases, but the adhesion strength increases. Moreover, the variation in the structures and properties of deposited films is associated with the variation of Cu atom fraction caused by pulse bias.