|
|||||
|
|
Wafer-bonding workshop for MEMS technologies (WBW-MEMS), 11–12 October 2004, Halle |
|
| Authors: | Bernd Michel Jörg Bagdahn |
| Affiliation: | (1) Editor of Microsystem Technologies, Berlin, Germany;(2) WBW-MEMS Organizer, Halle, Germany |
| Abstract: | |
| Keywords: | |
| 本文献已被 SpringerLink 等数据库收录！ | |