Study of an environment-friendly surface pretreatment of ABS-polycarbonate surface for adhesion improvement |
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| Affiliation: | 1. Thai Nguyen University of Technology, 3-2 Street, Thai Nguyen City, Viet Nam;2. Department of Mechanical Engineering, Ecole Polytechnique de Montréal, Montréal, QC H3C 3T5, Canada;3. iCantech Innovation Inc., 167 Rue Desrochers, J2H 0R2 Granby, QC, Canada;4. Faculty of Chemistry, VNU University of Science, 19 Le Thanh Tong str., Hanoi, Viet Nam;5. MiQro Innovation Collaborative Centre (C2MI), 45 boul. de l''Aéroport, Bromont, QC J2L 1S8, Canada;1. Instituto de Ingeniería Electroquímica y Corrosión (INIEC), Departamento de Ingeniería Química, Universidad Nacional del Sur, Av. Alem 1253, 8000 Bahía Blanca, Argentina;2. Instituto de Investigaciones Biológicas y Biomédicas del Sur (INBIOSUR), Departamento de Biología, Bioquímica y Farmacia, Universidad Nacional del Sur, San Juan 670, 8000 Bahía Blanca, Argentina |
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| Abstract: | In this paper, an environmentally friendly etching system containing MnO2–H3PO4–H2SO4 colloid was used to investigate surface etching for ABS- polycarbonate (PC/ABS) as a replacement for conventional chromic acid etching solutions. In order to obtain a good etching performance, a swelling system, containing tetramethylammonium hydroxide (TMAH), and 1-Methyl-2-pyrrolidinone (NMP), was used to investigate the surface swelling for PC/ABS resin. Then the effects of H2SO4 concentration, and etching time on the surface topographies and surface contact angle were investigated. After the optimal swelling and etching treatment, the surface contact angle of PC/ABS resin decreased from 95.7° to 28.3°, and the adhesion strength between electroless copper film and PC/ABS resin reached to 1.04 KN m?1. The FT-IR spectra and XPS analyses indicated that hydroxyl and carboxyl groups formed on the PC/ABS surface as a result of the swelling and etching treatment, which improved the adhesion strength between PC/ABS substrate and elctroless copper film. |
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| Keywords: | PC/ABS surface etching Manganese dioxide colloid Electroless copper plating Adhesion strength |
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