Adhesion improvement of electroless copper to PC substrate by a low environmental pollution MnO2–H3PO4–H2SO4–H2O system |
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| Affiliation: | 1. Key Laboratory of Applied Surface and Colloid Chemistry, Ministry of Education, and School of Chemistry and Chemical Engineering, Shaanxi Normal University, Xi''an 710062, China;2. School of Chemistry and Chemical Engineering, Ningxia Teachers University, Guyuan 756000, China;1. Department of Dermatology, Vanderbilt University Medical Center, Nashville, Tennessee;2. Department of Dermatology, The Center for Cutaneous Oncology, Dana-Farber Cancer Institute and Brigham and Women''s Hospital, Boston, Massachusetts;3. Department of Pathology, Brigham and Women''s Hospital, Boston, Massachusetts;4. Department of Medical Oncology, Dana-Farber Cancer Institute, Boston, Massachusetts;5. Department of Medical Oncology, Beth Israel Deaconess Medical Center, Boston, Massachusetts;1. College of Environmental Science and Engineering, North China Electric Power University, Beijing, 102206, China;2. North China Electric Power Research Institute Co Ltd., Beijing, 100045, China;1. Via Nizza, 46, 00198 Rome, Italy;2. CIR Dental School, Department of Surgical Sciences UNITO, via Nizza 230, 10126 Turin, Italy;3. Clinic for Fixed and Removable Prosthodontics and Dental Material Science, University of Zurich, Zurich, Switzerland;4. ARDEC Academy, Ariminum Odontologica, Rimini, Italy;5. Department of Oral Implantology, Osaka Dental University, Osaka, Japan |
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| Abstract: | A low environmental pollution etching system, MnO2–H2SO4–H3PO4–H2O colloid, was used to investigate surface etching performance of polycarbonate (PC) as a replacement for the chromic acid etching solution. The effects of H2SO4 concentrations, H3PO4 concentrations and etching times upon the surface topography, surface chemistry and surface roughness were studied. With the appropriate etching treatment, the surface average roughness (Ra) of PC substrates increased from 3 to 177 nm, and the adhesion strength between the electroless copper and PC substrate also reached 1.10 KN m?1. After the etching treatment, the PC surface became hydrophilic and the surface contact angle decreased from 95.2° to 24.8°. The intensity of C–O groups increased and the new functional groups (–COOH) formed on the PC surface with the etching treatment, which improved the adhesion strength between PC substrate and elctroless copper film. |
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