| 双马来酰亚胺树脂体系在封装基板上的应用 |
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| 引用本文： | 王敬锋,苏民社,孔凡旺,杨中强.双马来酰亚胺树脂体系在封装基板上的应用[J].绝缘材料,2009,42(4):44-48,52. |
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| 作者姓名： | 王敬锋 苏民社 孔凡旺 杨中强 |
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| 作者单位： | 广东生益科技股份有限公司,广东,东莞,523039 |
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| 基金项目： | 国家科技部支撑计划，粤港关键领域重点突破项目 |
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| 摘 要： | 介绍了半导体IC封装技术和封装基板的技术发展需求,阐述了双马来酰亚胺树脂的改性方法及其在封装基板上的应用,分析了三菱瓦斯化学公司的双马来酰亚胺-三嗪树脂(BT树脂)材料封装基板的特性,结果表明,该树脂可满足封装领域的技术要求,应用前景广阔.
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| 关 键 词： | IC封装 覆铜板 双马来酰亚胺-三嗪树脂(BT树脂) |
Application of Modified Bismaleimide Resin in Integrated Circuits Package Substrate |
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| WANG Jing-feng,SU Min-she,KONG Fan-wang,YANG Zhong-qiang.Application of Modified Bismaleimide Resin in Integrated Circuits Package Substrate[J].Insulating Materials,2009,42(4):44-48,52. |
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| Authors: | WANG Jing-feng SU Min-she KONG Fan-wang YANG Zhong-qiang |
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| Affiliation: | Guangdong Shengyi Sci.Tech.Co.Ltd.;Dongguan 523039;China |
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| Abstract: | The development and requirements for the IC package and substrate technology were summarized.The modification methods of bismaleimide resin and its applications in IC package substrate were reviewed;especially the characteristics of bismaleimide-triazine resin-based laminates for the IC substrate made by Mutsubishi Gas Chemical Co.were analyzed.The BT resin has long been applied to IC substrate applications,which means a promising application prospect. |
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