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Liquid cooling in the mini-rectangular fin heat sink with and without thermoelectric for CPU
Authors:Paisarn Naphon  Songkran Wiriyasart
Affiliation:Thermo-Fluids and Heat Transfer Enhancement Laboratory (TFHT), Department of Mechanical Engineering, Faculty of Engineering, Srinakharinwirot University, 63 Rangsit-Nakhornnayok Rd., Ongkharak, Nakhorn-Nayok, 26120, Thailand
Abstract:In the present study, the liquid cooling in the mini-rectangular fin heat sink with and without thermoelectric for CPU is studied. Six mini-rectangular fin heat sinks with two different material types and three different channel widths are fabricated from the copper or aluminum with the length, the width and the base thickness of 37, 37, 5 mm, respectively. The de-ionized water is used as coolant. Effects of channel width, coolant flow rate, material type of heat sink and run condition of PC on the CPU temperature are considered. The liquid cooling in mini-rectangular fin heat sink with thermoelectric is compared with the other cooling techniques. The thermoelectric has a significant effect on the CPU cooling of PC. However, energy consumption is also increased. The results of this study are expected to lead to guidelines that will allow the design of the cooling system with improved heat transfer performance of the electronic equipments.
Keywords:Liquid cooling   Heat sink   Thermoelectric
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