可对信号再处理的拼接红外探测器封装电学设计

随着线列型红外探测器技术的发展，对超大视场扫描的需求是线列型红外测器应用的重要方向，超大视场扫描通常需要由多片线列型红外探测器拼接完成，而拼接设计的核心主要是封装结构设计。如何将探测器信号完整的引出到封装体外，就是封装结构设计中电学设计需要做的工作。文章介绍了一种线列型红外探测器拼接结构的封装电学设计，首先介绍该拼接结构的拼接方式，然后介绍为满足该种结构的电学结构设计方案，尤其是对信号二次处理部分的电学结构设计方案，最后介绍针对该种电学结构方案进行的电学布线设计方案。

Electrical design of infrared detector package with signal reprocessing

With the development of linear infrared detector technology,the demand for ultra large field of view scanning is an important direction for application of linear infrared detectors. Ultra large field of view scanning is usually accomplished by splicing of multiple linear infrared detectors,and the core of the splicing design is mainly the packaging structure design. How to fully lead the detector signal completely out of the packaging body is what needs to be done in the electrical design of packaging structure design. The article introduces the packaging electrical design of a splicing structure of a linear infrared detector. Firstly,the splicing method of the splicing structure is described,including the splicing method of the spliced structure,as well as the electrical structural design scheme to meet the structure,especially for the secondary processing part of the signal. Finally,the electrical wiring design solution for the electrical structure scheme is presented.