| 光读出红外成像芯片真空封装研究 |
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| 引用本文： | 张云胜,冯飞,魏旭东,戈肖鸿,王跃林. 光读出红外成像芯片真空封装研究[J]. 传感器与微系统, 2015, 0(2): 44-46. DOI: 10.13873/J.1000-9787(2015)02-0044-03 |
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| 作者姓名： | 张云胜 冯飞 魏旭东 戈肖鸿 王跃林 |
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| 作者单位： | 1. 中国科学院 上海微系统与信息技术研究所，上海200050; 中国科学院大学，北京100049;2. 中国科学院 上海微系统与信息技术研究所,上海,200050 |
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| 基金项目： | 国家自然科学基金资助项目(60876081，61172151)；国家“863”计划资助项目 |
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| 摘 要： | 为解决光读出红外成像焦平面阵列器件的真空封装，提出了一种新颖的真空封装方法。该封装结构由可见光窗口、硅垫片和红外窗口三部分构成。硅垫片和可见光窗口（玻璃）通过阳极键合形成封装腔体，用于放置芯片；红外窗口不仅选择性增透8～14μm波段的红外辐射，且作为封装盖板；封装腔体和红外窗口在真空室内通过焊料键合完成真空封装。该封装结构通过了气密检测，并测试得到了200℃电烙铁热像图。
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| 关 键 词： | 真空封装 红外成像焦平面阵列 光读出 阳极键合 焊料键合 |
Vacuum packaging research of optically readable infrared imaging chip |
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| ZHANG Yun-sheng , FENG Fei , WEI Xu-dong , GE Xiao-hong , WANG Yue-lin. Vacuum packaging research of optically readable infrared imaging chip[J]. Transducer and Microsystem Technology, 2015, 0(2): 44-46. DOI: 10.13873/J.1000-9787(2015)02-0044-03 |
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| Authors: | ZHANG Yun-sheng FENG Fei WEI Xu-dong GE Xiao-hong WANG Yue-lin |
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| Abstract: | A novel vacuum packaging method is proposed for vacuum packaging optically readable infrared imaging focal plane array( ORIRFPA)device. The vacuum packaging structure is made up of three parts,a visible light window,a silicon spacer,and an infrared window. The silicon spacer is bonded to visible light window-glass using anodic bonding to form packaging cavity,for chip placement;infrared window is not only used to selectively transmit infrared radiation ranges from 8μm to 14μm,but also is used as packaging cover board;packaging cavity is solder bonded to infrared window in vacuum chamber. Then the packaging structure passes air tightness test,and thermal images of soldering iron at temperature 200℃ are test and obtained. |
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| Keywords: | vacuum packaging IRFPA optically readable anodic bonding solder bonding |
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