Indentation experiment and analysis on mold and resin material during the nanoimprint process

Analysis and experiment on mold and resin materials for the nanoimprint process are conducted in this study. We developed FEM analysis of indentation stress induced in mold materials when they come in contact with 1MPa expanded uniaxial stress. Experimental analyses of viscosity, thermal expansion coefficient, and shrinkage rate of acrylate-based UV resin are likewise undertaken. Experimentally, Hertzian indentation and adhesion tests are used as model test systems for the micro/nanoimprint process. For the study, indentation test variables investigated are the contact load for various mold materials such as Si, glass, and PDMS(polydimethylsiloxane). The adhesion test is performed to measure the maximum uniaxial load required to separate the mold from the resin material. The results highlight that the adhesion stresses are not negligible during the demoulding process, while the indentation stresses are negligible during the imprint process. This paper was presented at the 4th Asian Conference on Multibody Dynamics(ACMD2008), Jeju, Korea, August 20–23, 2008. Kee Sung Lee received Ph.D. degrees from KAIST in 1998. He worked as a Post doctor of NIST, USA in 1999 and 2000. Dr. Lee is currently a Professor at the School of Mechanical and Automotive Engineering at Kookmin University in Seoul, Korea. Dr. Lee’s research interests are in the area of material and fracture.