半导体封装快速养护炉辐射传热分析

半导体封装快速养护炉是半导体封装过程中的一个关键设备。半导体封装粘结工艺养护过程要术炉内温度均匀分布，现有养护炉不能满足这一要求。对养护过程炉内温度场进行理论分析．对于正确认识现有养护炉存在缺陷的原医具有重要的意义。通过对某养护炉炉内加热器表面与炉壁表面辐射换热分析发现，通过加热器与炉壁表面辐射换热的净交换功率小于加热器总功率的5%。从而证实，在进行养护炉温度场传热分析时．起主导传热作用的是传导传热方式，辐射传热方式可以被忽略。

Analysis of heat radiation in a snap curing oven

The snap curing oven is key equipment in the semiconductor packaging. The die bonding requires the temperature field of the oven to be even, but an existing curing oven cannot suit the requirement. It is very important to find the reasons of the oven defects through theory analysis of the temperature field of the curing oven. By the analysis of heat exchange of radiation, the paper found and verified that the net exchange power between heater surface and wall surfaces is less than 5 percent of total heating power by means of radiation, therefore the main way of transferring heat is heat transfer in the chamber, and radiation way can be omitted.