| 应用于COF的无胶基材尺寸稳定性研究 |
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| 引用本文： | 何为,薛卫东,王守绪,周国云.应用于COF的无胶基材尺寸稳定性研究[J].电子电路与贴装,2010(3):12-14. |
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| 作者姓名： | 何为 薛卫东 王守绪 周国云 |
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| 作者单位： | 电子科技大学应用化学系 |
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| 摘 要： | COF技术由于具备诸多优势，已经成为LCD驱动IC的主要封装技术。对三种无胶基材进行实验，通过测量孔径和误差之间的关系，得出1．5mm孔为引入误差最小的孔；测量真空层压后基材的尺寸稳定性，三种基材能够符合COF技术要求。
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| 关 键 词： | COF 无胶基材 尺寸稳定性 |
Research on Dimensional Stabilify of Adhesiveless FCCL Applied in COF |
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| Abstract: | COF technology has become the primary packaging technique for driver IC of LCD for many advantages. The properties between aperture and error were measured, and 1.5mm was the most feasible hole to estimate the distortion coefficient. According to the dimensional stability of material after laminating, these three kinds of FCCL can be used in COF technology. |
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| Keywords: | COF adhesiveless FCCL dimensional stability |
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