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Electron beam lithography using chemically-amplified resist: Resolution and profile control
Authors:V. A. Kudryashov   V. V. Krasnov   S. E. Huq   P. D. Prewett  T. J. Hall
Affiliation:

a Institute of Microelectronics Technology, Russian Academy of Sciences, 142432 Chernogolovka, Moscow District, Russia

b Central Microstructure Facility, Rutherford Appleton Laboratory, Chilton, Didcot, Oxon OX11 0QX, UK

c Department of Electrical Engineering, King's College London, Strand, London, WC2R 2LS, UK

Abstract:The effect of post exposure bake and softbake conditions on the sensitivity of AZPN114 has been investigated experimentally. A bilayer system for undercut structures has been achieved using two layers of AZPN114 with different softbake temperatures. A single layer of AZPN114 has also been used to produce undercut and tailored resist profiles by two different multiple exposure strategies at different beam energies.
Keywords:
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