| AlN基板表面处理对薄膜附着力的影响 |
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| 引用本文： | 刘刚,王从香,符鹏.AlN基板表面处理对薄膜附着力的影响[J].电子元件与材料,2005,24(9):45-47. |
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| 作者姓名： | 刘刚 王从香 符鹏 |
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| 作者单位： | 南京电子技术研究所,江苏,南京,210013 |
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| 摘 要： | 用扫描电镜和X射线能谱分析仪研究高温氧化及薄膜工艺过程中主要溶液对氮化铝陶瓷(AlN)基板的影响。结果表明:高温氧化使表面氧含量增加,在1000℃氧化2h,表面已形成致密的氧化层。碱性溶液清洗和去离子水煮会使表面产生多孔的疏松化合物。采用高温氧化、酸性清洗、溅射前加强离子轰击等措施,磁控溅射TiCu,其薄膜膜层附着力不低于15MPa。
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| 关 键 词： | 无机非金属材料 AlN 表面处理 薄膜 附着力 |
| 文章编号： | 1001-2028(2005)09-0045-03 |
| 修稿时间： | 2005年3月31日 |
Influence of AlN Ceramic Substrate Surface Treatment on Thin Film Adhesion |
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| LIU Gang,WANG Cong-xiang,FU Peng.Influence of AlN Ceramic Substrate Surface Treatment on Thin Film Adhesion[J].Electronic Components & Materials,2005,24(9):45-47. |
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| Authors: | LIU Gang WANG Cong-xiang FU Peng |
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| Abstract: | The influence of oxidation treatment and immersing in main solutions on AlN substrate surface properties was studied by SEM and XPS. The results shows that oxygen content of AlN surface increased after high temperature oxidation,a high density Al2O3 layer formed after 2 h oxidation at 1 000℃. In alkaline solution or boiling deionized water a kind of porous compound was formed. By high temperature oxidation,acid solution cleaning,plasma cleaning before sputtering,magnetron-sputtering Ti/Cu film,the thin film adhesion is not less than 15 Mpa. |
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| Keywords: | AlN |
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