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| 基于田口方法的合金薄膜铜衬底超精密抛光工艺优化研究 | |
| 引用本文： | 朱从容,袁巨龙,吕冰海,文东辉. 基于田口方法的合金薄膜铜衬底超精密抛光工艺优化研究[J]. 微细加工技术, 2008, 0(4) |
| 作者姓名： | 朱从容 袁巨龙 吕冰海 文东辉 |
| 作者单位： | 1. 浙江海洋学院,机电工程学院,机械系,舟山,316004 2. 浙江工业大学,机电工程学院,超精密工程研究室,杭州,310014 3. 湖南大学,国家高效磨削工程技术研究中心,长沙,410082 |
| 基金项目： | 国家自然科学基金，浙江省教育厅资助项目，浙江省重中之重学科开放基金 |
| 摘 要： | 为了获得性能优良的电化学沉积合金薄膜,需要精度非常高的合金薄膜铜衬底.以铜衬底表面粗糙度Ra和Rt为评价目标,探讨了基于田口方法的铜衬底抛光工艺参数优化设计方法.在给定工件材料和磨料(种类和粒度)的条件下,加工载荷、磨料浓度和加工速度是影响铜衬底抛光表面质量的主要工艺参数.运用田口方法进行了实验设计,并通过对实验结果的分析,得出了最佳的抛光工艺参数组合,采用该实验条件进行加工获得了非常光滑的铜衬底表面(Ra 6 nm,Rt 60 nm),表明田口方法能够有效的应用于铜衬底抛光工艺参数的优化设计和分析. |
| 关 键 词： | 田口方法 铜衬底 抛光 工艺优化 |
Parameters Optimization on the Polishing Process for the Alloy Films on Copper Substrates Based on Taguchi Method |
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| ZHU Cong-rong,YUAN Ju-long,LV Bing-hai,WEN Dong-hui. Parameters Optimization on the Polishing Process for the Alloy Films on Copper Substrates Based on Taguchi Method[J]. Microfabrication Technology, 2008, 0(4) | |
| Authors: | ZHU Cong-rong YUAN Ju-long LV Bing-hai WEN Dong-hui |
| Affiliation: | ZHU Cong-rong1,YUAN Ju-long2,LV Bing-hai3,WEN Dong-hui2(1.College of Mechanical Engineering,Zhejiang Ocean University,Zhoushan 316004,China,2.Precision Engineering Laboratory,Zhejiang University of Technology,Hangzhou 310014,3.National Engineering Research Center for High Efficiency Grinding,Hunan University,Changsha 410082,China) |
| Abstract: | To obtain the amorphous alloy films with superior properties by electrochemical deposition,the accuracy requirement of copper substrates is extraordinarily strict.The application of Taguchi method for optimization of copper substrate polishing process parameters to obtain the best finish was introduced.An optimization experiment for polishing copper substrate with diamond was designed by Taguchi method.Surface roughness Ra and Rt are considered as criteria for optimization.Influence of parameters involving ... |
| Keywords: | taguchi method copper substrate polishing parameters optimization |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |