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提高切片机刀片寿命的探讨
引用本文:杜兴益.提高切片机刀片寿命的探讨[J].上海有色金属,1991(5).
作者姓名:杜兴益
作者单位:上海第二冶炼厂
摘    要:实验指出,内圆切片机切片时,采用负向切片,对提高硅片均匀性及便于机械手取片是可取的,但会增加修刀次数,降低刀片寿命。掌握刀片刃口和基面的修磨技术是提高刀片寿命的关键。

关 键 词:半导体    切片机  刀片

A Way to Prolong Service Life of Blades for Slicing Machine
Du Xingyi.A Way to Prolong Service Life of Blades for Slicing Machine[J].Shanghai Nonferrous Metals,1991(5).
Authors:Du Xingyi
Affiliation:Shanghai Second Smelter
Abstract:lt is shown through experiments that when slicing on the inner circular slicing machine, it is recommendable to adopt the method of slicing in the negative direction because silicon wafers thus sliced are uniform in thickness and easy to remove by the manipulator. But by so doing, more grindings of the blades are needed with the result that the service life of the blades are shortened. A' way to prolong the service life of the blades recommended by the author is to master proper grinding technique for the edges and the base plane of the blades.
Keywords:Semiconductor  Silicon  Slicing machine  Blade
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