Thermal resistance investigations on new leadframe-based LED packages and boards |
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| Authors: | B. Pardo,A. Gasse,A. Fargeix,J. Jakovenko,R.J. Werkhoven,X. Perpiñ à ,X. Jordà ,M. Vellvehi,T. Van Weelden,P. Bancken |
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| Affiliation: | 1. CEA, LETI, MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France;2. Department of Microelectronics, Czech Technical University in Prague, Czech Republic;3. TNO, P.O. Box 6235, 5600 HE Eindhoven, The Netherlands;4. Instituto de Microelectrónica de Barcelona-Centro Nacional de Microelectrónica, IMB-CNM (CSIC), Campus UAB, Bellaterra, Spain;5. Boschman Technologies, Stenograaf 3, 6921 EX Duiven, The Netherlands;6. Philips Lighting, LED Platform Development, Mathildelaan 1, 5611 BD Eindhoven, The Netherlands |
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| Abstract: | In Solid State Lighting, thermal management is a key issue. Within the CSSL consortium, we have developed an advanced leadframe based LED package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys® software and thermal measurements have been carried out using the forward voltage method to derive the thermal resistance. The T3ster® transient thermal analysis has been used to determine the different thermal resistance contributions in the package and in the board, showing good correlation between experimental and simulation results. As a result, low thermal resistances of 5.5 K/W have been obtained on our advanced leadframe based LED package and have been compared with the standard configuration of multiple Rebel LEDs on FR4 board. |
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